BGA Reball Service

• Use equipment certified by major manufacturers in BGA ball mount, resolder, re-flow and change solder ball works.
• Specialize in FLASH DRAM, SSD, DDR, HDD, southbridge, northbridge, monitor chips and other electronic components.
• Mass production on DRAM IC and FLASH IC. Mass production on DRAM/FLASH de-soldering and BGA ball mounting .

Why choose MEGA?

• We have high quality production process certified by the original manufacturers
• High specifications machinery • High specifications ESD (Electro Static Discharge) equipment
•Quality •High Yield Rate •Efficiency (Return Time)
•Dependable •Cost saving
Ball mounting Quality, trustworthiness, professionalism, and high yield rate in backend SMT process.

We insist:
• BGA ball mount machinery (high precision, high yield rate and low contamination)
• The best quality solder balls approved by major chip makers.
• Water-base detergent, water soluble flux. Clean alkaline and acidic adhesions left from processing with pure water.
• Adopt automatic manufacturing process to reduce hand contact. Prevent touch IC to avoid solder balls from oxidization.
** Adopt High yield rate IC allow later SMT manufacturing process to produce products with high yield rate. Reduce testing and maintenance time. Reduce RMA. Promote efficiency. Promote productivity. Cost saving.